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DIL/BGA

The BGA (Ball Grid Array) is a type of microchip package. BGA package use a group of solder dots, or balls, arranged in concentric rectangles to connect to a circuit board.

BGA Package Converters
 
Description
Part No.
BGA-Top-41 ZIF-CS
pins
 BGA44
Socket
ZIF BGA40 (accept package up to 96 balls), ClamShell type
 
QSOP / DIP Package Converters
 
Part Numbers to Order
Part NO.
BGA-Top-7 ZIF-CS
pins
 BGA64
Socket
 ZIF BGA64 (accept package up to 120 balls), ClamShell type
 
QSOP / DIP Package Converters
 
Part Numbers to Order
Part No.
BGA-Top-44 ZIF
pins
 BGA256
Socket
ZIF BGA256 (accept package up to 289 balls), open top type

 

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