IC Test And Burn-in Socket

What is a package ?
The many different functions of semiconductor devices are made possible by integrated circuits, which are built into the surface of a silicon chip (bear chip) using a complex process. If these chips could be used in unmodified form, packaging would be unnecessary, and the cost of chips reduced. However, because silicon chips are very delicate, even a tiny speck of dust or drop of water can hinder their function. Light can also cause malfunctions. To combat these problems, silicon chips are protected by packaging.

Nowadays, high value-added packaging technologies such as SiP (System in a Package) are available. The role of SiP goes beyond "protecting" and is now a mandatory technology for high function products, and a critical factor in customer purchasing decisions.

	BGA ( Ball Grid Array )		DIP ( Dual In-Line Package )
	MLF ( Micro Lead Frame )		PLCC ( Plastic Leaded Chip Carrier )
	QFN ( Quad Flatpack Package )		QFP ( Quad Flatpack Package )
	SOIC ( Small Out-Line Integrated Circuit )		SOP ( Small Out-Line Package )
	TSOP ( Think Small Out-Line Package )		SSOP ( Shrink Small Out-Line Package )