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| QFN封装 测试座/插座 | |
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QFN(Quad Flat No-lead Package,方形扁平无引脚封装)封装是一种焊盘尺寸小、体积小、以塑料作为密封材料的新兴表面贴装芯片封装技术.由于底部中央大暴露焊盘被焊接到PCB的散热焊盘上,这使得QFN具有极佳的电和热性能。 深圳得技通电子有限公司代理QFN封装 测试座/插座 厂商列表如下： |
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Enplas is striving to gaze into the future through "OPTPLANICS": a new concept that fuses the latest optical and electronics technologies on the basis of engineering plastics, the highly functional materials that Enplas has been pursuing since its inception. |
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YAMAICHI ELECTRONICS Deutschland GmbH. was established in 1990 and it′s headqaurters are located in Munich. We are your European partner for sockets, connectors, cables and fine pitch flexible printed circuits. Yamaichi has approx. 180 employees in Europe, and last year achieved a turnover of more than 36 million Euro. Our network includes a knowledgeable and experienced sales staff in Germany, Italy, the UK and France. Also we are supported by a European network of exclusive distributors. |
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Plastronics was founded over 30 years ago for the exclusive purpose of designing, manufacturing and marketing high-quality burn-in sockets. With corporate offices located in Irving, Texas and a manufacturing facility in Grand Prarie Texas, Plastronics' mission is simple: "Provide quality, cost-effective socket solutions to meet the harsh demands of the burn-in test market." |
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QFN |
QFN package is smaller and cooler than TSSOP. Texas Instruments, IDT and Hitachi have combined to introduce 20-, 16- and 14-pin quad flat no-lead (QFN) packaging for gate and octal bit width logic devices. |
| QFN Socket; IC Socket;QFN Package Socket;QFN IC Socket; |
